Methods and apparatus for packaging integrated circuit devices

Details Methods and apparatus for packaging integrated circuit devices Methods and apparatus for packaging integrated circuit devices

2007-01-30

2009-02-24

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C257S693000, C257SE23061, C257SE23070

Reexamination Certificate

active

07495341

ABSTRACT:
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging layer formed over the semiconductor circuitry and the first generally planar surface, an insulation layer formed over the second generally planar surface and the edge surfaces and at least one electrical conductor formed directly on the insulation layer overlying the second generally planar surface, the at least one electrical conductor being connected to the circuitry by at least one pad formed directly on the first generally planar surface.

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