Methods and apparatus for packaging integrated circuit devices

Details Methods and apparatus for packaging integrated circuit devices Methods and apparatus for packaging integrated circuit devices

2007-03-20

2007-03-20

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S064000, C438S113000, C257SE21499

Reexamination Certificate

active

10884058

ABSTRACT:
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging layer formed over the semiconductor circuitry and the first generally planar surface, an insulation layer formed over the second generally planar surface and the edge surfaces and at least one electrical conductor formed directly on the insulation layer overlying the second generally planar surface, the at least one electrical conductor being connected to the circuitry by at least one pad formed directly on the first generally planar surface.

REFERENCES:
patent: 2507956 (1950-05-01), Bruno et al.
patent: 2796370 (1957-06-01), Ostrander et al.
patent: 2851385 (1958-09-01), Spruance et al.
patent: 3648131 (1972-03-01), Stuby
patent: 3761782 (1973-09-01), Youmans
patent: 3981023 (1976-09-01), King et al.
patent: 4259679 (1981-03-01), Knibb et al.
patent: 4279690 (1981-07-01), Dierschke
patent: 4339689 (1982-07-01), Yamanaka et al.
patent: 4551629 (1985-11-01), Carson et al.
patent: 4764846 (1988-08-01), Go
patent: 4794092 (1988-12-01), Solomon
patent: 4797179 (1989-01-01), Watson et al.
patent: 4862249 (1989-08-01), Carlson
patent: 4933601 (1990-06-01), Sagawa et al.
patent: 4984358 (1991-01-01), Nelson
patent: 5037779 (1991-08-01), Whalley et al.
patent: 5104820 (1992-04-01), Go et al.
patent: 5118924 (1992-06-01), Mehra et al.
patent: 5124543 (1992-06-01), Kawashima
patent: 5126286 (1992-06-01), Chance
patent: 5177753 (1993-01-01), Tanaka
patent: 5250462 (1993-10-01), Sasaki et al.
patent: 5266501 (1993-11-01), Imai
patent: 5266833 (1993-11-01), Capps
patent: 5321303 (1994-06-01), Kawahara et al.
patent: 5455386 (1995-10-01), Brathwaite et al.
patent: 5500540 (1996-03-01), Jewell et al.
patent: 5526449 (1996-06-01), Meade et al.
patent: 5546654 (1996-08-01), Wojnarowski et al.
patent: 5567657 (1996-10-01), Wojnarowski et al.
patent: 5595930 (1997-01-01), Baek
patent: 5612570 (1997-03-01), Eide et al.
patent: 5657206 (1997-08-01), Pedersen et al.
patent: 5661087 (1997-08-01), Pedersen et al.
patent: 5672519 (1997-09-01), Song et al.
patent: 5675180 (1997-10-01), Pedersen et al.
patent: 5677200 (1997-10-01), Park et al.
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5817541 (1998-10-01), Averkiou et al.
patent: 5837562 (1998-11-01), Cho
patent: 5837566 (1998-11-01), Pedersen et al.
patent: 5849623 (1998-12-01), Wojnarowski et al.
patent: 5857858 (1999-01-01), Gorowitz et al.
patent: 5859475 (1999-01-01), Freyman et al.
patent: 5869353 (1999-02-01), Levy et al.
patent: 5888884 (1999-03-01), Wojnarowski
patent: 5891761 (1999-04-01), Vindasius et al.
patent: 5900674 (1999-05-01), Wojnarowski et al.
patent: 5909052 (1999-06-01), Ohta et al.
patent: 5910687 (1999-06-01), Chen et al.
patent: 5938452 (1999-08-01), Wojnarowski
patent: 5952712 (1999-09-01), Ikuina et al.
patent: 5965933 (1999-10-01), Young et al.
patent: 5985695 (1999-11-01), Freyman et al.
patent: 5986746 (1999-11-01), Metz et al.
patent: 5993981 (1999-11-01), Askinazi et al.
patent: 6002163 (1999-12-01), Wojnarowski
patent: 6020217 (2000-02-01), Kuisi et al.
patent: 6046410 (2000-04-01), Wojnarowski et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6080596 (2000-06-01), Vintasius et al.
patent: 6083766 (2000-07-01), Chen
patent: 6087586 (2000-07-01), Chen
patent: 6092280 (2000-07-01), Wojnarowski
patent: 6098278 (2000-08-01), Vindasius et al.
patent: 6106735 (2000-08-01), Kurle et al.
patent: 6124179 (2000-09-01), Adamic, Jr.
patent: 6124637 (2000-09-01), Freyman et al.
patent: 6134118 (2000-10-01), Pedersen et al.
patent: 6221751 (2001-04-01), Chen et al.
patent: 6235141 (2001-05-01), Feldman et al.
patent: 6265763 (2001-07-01), Jao et al.
patent: 6326689 (2001-12-01), Thomas
patent: 6429036 (2002-08-01), Nixon et al.
patent: 6548911 (2003-04-01), Yu et al.
patent: 6562647 (2003-05-01), Zandman et al.
patent: 6607941 (2003-08-01), Prabhu et al.
patent: 6624505 (2003-09-01), Badehi
patent: 6646289 (2003-11-01), Badehi
patent: 6768190 (2004-07-01), Yang et al.
patent: 6903012 (2005-06-01), Geefay et al.
patent: 6982475 (2006-01-01), MacIntyre
patent: 2002/0016024 (2002-02-01), Thomas
patent: 2006/0091488 (2006-05-01), Kang
patent: 11 326366 (2000-02-01), None
patent: WO 85/02283 (1985-05-01), None
patent: WO 89/04113 (1989-05-01), None
patent: WO 95/19645 (1995-07-01), None
patent: WO 96/19645 (1996-06-01), None
patent: WO-99/40624 (1999-08-01), None
Patent Abstract of Japan vol. 2000, No. 02, Feb. 29, 2000, & JP 11 326366.
“First Three-Chip Staked CSP Developed”, Semiconductor International, Jan. 2000, p. 22.
“High Density Pixel Detector Module Using Flip Chip and Thin Film Technology”, J. Wolf, et al, International System Packaging Symposium, Jan. 1999, San Diego.
A. Fan, et al, “Copper Wafer Bonding”, Electrochemical and Solid-State Letters 2(10) 534-536, 1999.

Affiliated with

Also associated with

Rating

Methods and apparatus for packaging integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for packaging integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for packaging integrated circuit devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3745482