4. Stock material or miscellaneous articles
  5. Coated or structually defined flake, particle, cell, strand,...
  6. Rod, strand, filament or fiber

Tomohiro Uno

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Bonding wire for semiconductor device

Electricity: conductors and insulators – Conduits – cables or conductors – Combined
Reexamination Certificate

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Bonding wire for semiconductor device

Electricity: conductors and insulators – Conduits – cables or conductors – Combined
Reexamination Certificate

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Bonding wire for semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Copper alloy bonding wire for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Gold alloy thin wire for semiconductor devices

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent

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Profile ID: LFUS-PAI-P-1237872

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