4. Stock material or miscellaneous articles
  5. Coated or structually defined flake, particle, cell, strand,...
  6. Rod, strand, filament or fiber

Tanaka Denshi Kogyo Kabushiki Kaisha

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Alloy connecting materials for semiconductors

Alloys or metallic compositions – Lead base – Alkali – alkaline earth metal or magnesium containing
Patent

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Clad bonding wire for semiconductor device

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
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Fine lead alloy wire for forming bump electrodes

Alloys or metallic compositions – Lead base – Tin containing
Patent

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Fine wire for forming bump electrodes using a wire bonder

Alloys or metallic compositions – Gallium – indium – or thallium base
Patent

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Gold bonding wire for semiconductor elements and the semiconduct

Alloys or metallic compositions – Gold base – Silver containing
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