Gold bonding wire for semiconductor elements and the semiconduct

Details Gold bonding wire for semiconductor elements and the semiconduct Gold bonding wire for semiconductor elements and the semiconduct

1980-06-17

1982-05-18

Roy, Upendra

Alloys or metallic compositions

Gold base

Silver containing

428620, 428641, 29589, C22C 500

Patent

active

043303293

ABSTRACT:
A bonding gold wire for semiconductor elements comprising a gold alloy containing silver (Ag), calcium (Ca), iron (Fe), and magnesium (Mg) with or without an additional element selected from the group consisting of germanium, beryllium, gallium, and thallium, with the substantial balance being gold.

REFERENCES:
patent: 3434828 (1969-03-01), Cornelison
patent: 3667937 (1972-06-01), Ingersoll et al.
patent: 4080485 (1978-03-01), Bonkohara

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