Alloy connecting materials for semiconductors

Alloys or metallic compositions – Lead base – Alkali – alkaline earth metal or magnesium containing

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148400, 420562, 420570, 420571, 428645, 437180, C22C 1300, C22C 1100

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053666925

ABSTRACT:
A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

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English translation of claim 1 of Japanese patent 63-301535.

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