Fine wire for forming bump electrodes using a wire bonder

Alloys or metallic compositions – Gallium – indium – or thallium base

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420558, 420559, 420563, 420566, 420570, 420571, 420587, 420589, 420580, 420573, 420562, 428606, C22C 1300, C22C 1100, C22C 2800, C22C 3000

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053840909

ABSTRACT:
This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

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patent: 4654275 (1987-03-01), Bose et al.

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