Fine lead alloy wire for forming bump electrodes

Details Fine lead alloy wire for forming bump electrodes Fine lead alloy wire for forming bump electrodes

1994-09-30

1996-05-07

Yee, Deborah

Alloys or metallic compositions

Lead base

Tin containing

420570, 420566, 420563, 420580, 420587, 420588, 420589, C22C 1104, C22C 1106, C22C 1110, C22C 1108

Patent

active

055143342

ABSTRACT:
This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

REFERENCES:
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patent: 2623273 (1952-12-01), Murray et al.
patent: 3607252 (1971-09-01), North
patent: 3716909 (1973-02-01), Stokes et al.
patent: 3833362 (1974-09-01), Postupack
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patent: 4070192 (1978-01-01), Arbib et al.
patent: 4331739 (1982-05-01), Narasimhan
patent: 4504849 (1985-03-01), Davies et al.
patent: 4654275 (1987-03-01), Bose et al.
English Language Abstract of Japanese Patent Document No. 63-168031.
English Language Abstract of Japanese Patent Document No. 63-168036.
English Language Abstract of Japanese Patent Document No. 4-174527.
English Language Abstract of Japanese Patent Document No. 53-86572.

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