4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having insulated gate

Peniel M Gumedzoe

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Chip package structure and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
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CMOS image sensor and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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CMOS image sensor and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Crackstop structures and methods of making same

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
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Profile ID: LFUS-PAI-P-2157115

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