4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Field effect device
  6. Having insulated electrode

Mong-Song Liang

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3D reservoir to improve electromigration resistance of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion of copper and etch stop layer for copper alloy

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion of copper and etch stop layer for copper alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Anti-punchthrough ion implantation for sub-half micron channel l

Fishing – trapping – and vermin destroying
Patent

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Barrier free copper interconnect by multi-layer copper seed

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-179238

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