4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Responsive to electromagnetic radiation

Kuo-Chung Yee

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Method for manufacturing package structure of optical device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Method of fabricating anti-warp package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Reexamination Certificate

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Method of fabricating anti-warp package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Reexamination Certificate

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Method of making a package structure by dicing a wafer from...

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Micro-mirror package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2192920

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