Micro-mirror package

Details Micro-mirror package Micro-mirror package

2006-05-30

2006-05-30

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C438S106000, C257S788000, C257S784000, C257S783000, C257S678000

Reexamination Certificate

active

07053488

ABSTRACT:
A micro-mirror package comprising a substrate, a bottom substrate, a cover substrate, a semiconductor chip, a first adhesive, a second adhesive, a plurality of wires and a lid is provided. The substrate has a circular wall. The bottom substrate is disposed on the substrate within the circular wall. The first adhesive is provided with first spacers for attaching the cover substrate to the semiconductor chip and setting the cover substrate and the semiconductor chip apart. The second adhesive is provided with second spacers for attaching the semiconductor chip to the bottom substrate and setting the semiconductor chip and the bottom substrate apart. The wires are used for electrically connecting the semiconductor chip and the substrate. The lid is disposed on top of the circular wall.

REFERENCES:
patent: 6415505 (2002-07-01), Glenn
patent: 6950224 (2005-09-01), Chen et al.
patent: 2005/0017334 (2005-01-01), Tao

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