Method of fabricating anti-warp package

Details Method of fabricating anti-warp package Method of fabricating anti-warp package

2008-04-01

2008-04-01

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

C438S110000, C438S112000, C438S113000, C438S121000, C438S127000, C438S106000, C438S460000, C438S464000, C257SE21502

Reexamination Certificate

active

10904760

ABSTRACT:
An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location underneath the surrounding area of the chip. Through the disposition of a stiffening member, warping stress on the packaging substrate when the chip is encapsulated by molding compound is counterbalanced.

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