Method of fabricating anti-warp package

Details Method of fabricating anti-warp package Method of fabricating anti-warp package

2008-04-01

2008-04-01

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

C438S110000, C438S112000, C438S113000, C438S121000, C438S127000, C438S106000, C438S460000, C438S464000, C257SE21502

Reexamination Certificate

active

07352071

ABSTRACT:
An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location underneath the surrounding area of the chip. Through the disposition of a stiffening member, warping stress on the packaging substrate when the chip is encapsulated by molding compound is counterbalanced.

REFERENCES:
patent: 6110755 (2000-08-01), Muramatsu et al.
patent: 6194291 (2001-02-01), DiStefano et al.
patent: 6287895 (2001-09-01), Sato
patent: 6348399 (2002-02-01), Lin
patent: 6355499 (2002-03-01), Wu et al.
patent: 6469530 (2002-10-01), Johnson et al.
patent: 6489218 (2002-12-01), Kim et al.
patent: 6815817 (2004-11-01), Akram et al.
patent: 6849933 (2005-02-01), Koike et al.
patent: 7166490 (2007-01-01), Michii et al.
patent: 2002/0074672 (2002-06-01), Huang et al.
patent: 2003/0146511 (2003-08-01), Zhao et al.
patent: 2004/0058478 (2004-03-01), Islam et al.
patent: 2004/0104488 (2004-06-01), Tao et al.
patent: 2005/0035452 (2005-02-01), Zhang et al.
patent: 2005/0146056 (2005-07-01), Shibata
patent: 2005/0184364 (2005-08-01), Kim et al.
patent: 2005/0214980 (2005-09-01), Shiu et al.

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