Method for manufacturing package structure of optical device

Details Method for manufacturing package structure of optical device Method for manufacturing package structure of optical device

2011-08-23

2011-08-23

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S064000, C438S065000

Reexamination Certificate

active

08003426

ABSTRACT:
A package structure of optical devices has a chip, a sealant, a cover, a substrate, a plurality of bonding wires, and a transparent encapsulant. The chip has at least an optical device and a plurality of chip connection pads. The sealant is disposed around the optical elements. The cover is disposed on the sealant. The substrate supports the chip and has a plurality of connection pads. The bonding wires are used for electrically connecting the chip connection pads of the chip to the connection pads of the substrate. The transparent encapsulant is formed over the substrate and the cover, and encapsulates the bonding wires.

REFERENCES:
patent: 5786266 (1998-07-01), Boruta
patent: 5904548 (1999-05-01), Orcutt
patent: 6271102 (2001-08-01), Brouillette et al.
patent: 6518079 (2003-02-01), Imler
patent: 7001797 (2006-02-01), Hashimoto
patent: 7012012 (2006-03-01), Yeom et al.
patent: 7405100 (2008-07-01), Mostafazadeh et al.

Affiliated with

Also associated with

Rating

Method for manufacturing package structure of optical device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing package structure of optical device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing package structure of optical device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2635002