Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Attorney
active
No affiliations
3D chip-stack with fuse-type through silicon via
BLM structure for application to copper pad
Combined stepper and deposition tool
Contact forming method and related semiconductor device
Hybrid metallic wire and methods of fabricating same
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Profile ID: LFUS-PAI-P-2167725