Electronic digital logic circuitry – Multifunctional or programmable – Having details of setting or programming of interconnections...
Reexamination Certificate
2009-01-22
2010-10-19
Le, Don P (Department: 2819)
Electronic digital logic circuitry
Multifunctional or programmable
Having details of setting or programming of interconnections...
C327S525000
Reexamination Certificate
active
07816945
ABSTRACT:
Programmable fuse-type through silicon vias (TSVs) in silicon chips are provided with non-programmable TSVs in the same chip. The programmable fuse-type TSVs may employ a region within the TSV structure having sidewall spacers that restrict the cross-sectional conductive path of the TSV adjacent a chip surface contact pad. Application of sufficient current by programming circuitry causes electromigration of metal to create a void in the contact pad and, thus, an open circuit. Programming may be carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
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International Application No. PCT/EP2009/065814, PCT/ISA/220 Notification of Transmittal of The International Search Report and The Written Opinion of the International Searching Authority, or the Declaration dated Apr. 3, 2010.
Feng Kai Di
Hsu Louis Lu-Chen
Wang Ping-Chuan
Yang Zhijian
Brown Katherine S.
International Business Machines - Corporation
Jordan John A
Le Don P
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