4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

James P. Letterman, Jr.

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Electronic component and method of manufacture

Metal fusion bonding – Process – Plural joints
Patent

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Encapsulated chip scale package having flip-chip on lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Encapsulated chip scale package having flip-chip on lead...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Encapsulated semiconductor package having protectant circular in

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Method for manufacturing a semiconductor component and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-51570

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