Electronic component and method of manufacture

Details Electronic component and method of manufacture Electronic component and method of manufacture

1998-07-01

2000-12-26

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

29843, B23K 3100, B23K 3102, H05K 300

Patent

active

061645230

ABSTRACT:
A method of manufacturing an electronic component includes providing a substrate (101), forming a semiconductor device in the substrate (101), depositing a metal layer (107) over the substrate (101) and electrically coupled to the semiconductor device, depositing a layer (108) of solder over the metal layer, and wire bonding a wire (109) to the metal layer (107).

REFERENCES:
patent: 3413711 (1968-12-01), Brewer et al.
patent: 3672047 (1972-06-01), Sakamoto et al.
patent: 4014660 (1977-03-01), Schreiner et al.
patent: 4463059 (1984-07-01), Bhattacharya et al.
patent: 5047833 (1991-09-01), Gould
patent: 5288007 (1994-02-01), Interrante et al.
patent: 5445311 (1995-08-01), Trask et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5612256 (1997-03-01), Stansbury
patent: 5841183 (1998-11-01), Ariyoshi
patent: 5852871 (1998-12-01), Khandros
patent: 5900738 (1999-05-01), Khandros et al.
patent: 5904496 (1999-05-01), Richards et al.
patent: 5906312 (1999-05-01), Zakel et al.

Affiliated with

Also associated with

Rating

Electronic component and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component and method of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-985979