Encapsulated chip scale package having flip-chip on lead...

Details Encapsulated chip scale package having flip-chip on lead... Encapsulated chip scale package having flip-chip on lead...

2005-08-18

2008-10-21

Clark, S. V (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000

Reexamination Certificate

active

07439100

ABSTRACT:
In one embodiment, an encapsulated electronic package includes a semiconductor chip having patterned solderable pads formed on a major surface. During an assembly process, the patterned solderable pads are directly affixed to conductive leads. The assembly is encapsulated using, for example, a MAP over-molding process, and then placed through a separation process to provide individual chip scale packages having flip-chip on lead frame interconnects.

REFERENCES:
patent: 5776798 (1998-07-01), Quan et al.
patent: 6621152 (2003-09-01), Choi et al.
patent: 6630728 (2003-10-01), Glenn
patent: 6689640 (2004-02-01), Mostafazadeh
patent: 6841414 (2005-01-01), Hu et al.
patent: 6856017 (2005-02-01), Yoneda et al.
patent: 7033866 (2006-04-01), Chow et al.
patent: 7262491 (2007-08-01), Islam et al.
patent: 2002/0031902 (2002-03-01), Pendse et al.
patent: 2003/0015780 (2003-01-01), Kang et al.
patent: 2004/0061221 (2004-04-01), Schaffer
patent: 2004/0108580 (2004-06-01), Tan et al.
patent: 2004/0178494 (2004-09-01), Lin et al.
patent: 2005/0006737 (2005-01-01), Islam et al.
patent: 2005/0127483 (2005-06-01), Joshi et al.
patent: 2006/0170081 (2006-08-01), Gerber et al.
patent: 2007/0111374 (2007-05-01), Islam et al.
patent: 2007/0161157 (2007-07-01), Islam et al.
“Solderability”, efunda.com, engineering fundamentals, www.efunda.com/materials/solders/solderability.cfm, Copyright 2005 eFunda, 2 pages.

Affiliated with

Also associated with

Rating

Encapsulated chip scale package having flip-chip on lead... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulated chip scale package having flip-chip on lead..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulated chip scale package having flip-chip on lead... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4018016