Method for manufacturing a semiconductor component and...

Details Method for manufacturing a semiconductor component and... Method for manufacturing a semiconductor component and...

2009-01-29

2011-12-06

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C257S666000, C257SE21502

Reexamination Certificate

active

08071427

ABSTRACT:
A semiconductor component having wetable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components.

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“Soldering the QFN Stacked Die Sensors to a PC Board,” by Thomas Koschmieder, Cheol Han, Kimberly Tuck, and John Dixon, Freescale Semiconductor Application Note AN3111, Rev 5, Apr. 2010, 9 pages.

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