Jacob Riseman

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Beam-lead integrated circuit structure and method for making the

Metal fusion bonding – Process – Plural joints
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Charge injector transistor memory

Static information storage and retrieval – Systems using particular element – Capacitors
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Chem-mech polishing method for producing coplanar metal/insulato

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Composite channel field effect transistor and method of fabricat

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Deep dielectric isolation by fused glass

Coating processes – Electrical product produced – Condenser or capacitor
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Profile ID: LFUS-PAI-P-63587

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