Metal fusion bonding – Process – Plural joints
Patent
1976-07-30
1977-06-28
Smith, Al Lawrence
Metal fusion bonding
Process
Plural joints
228188, 29626, H01L 2160
Patent
active
040320588
ABSTRACT:
A beam-lead integrated circuit chip structure which comprises a semiconductor chip substrate having a passivated planar surface from which active and passive devices in the circuit extend into the substrate. A plurality of peripheral beam-leads interconnected with the chip devices extend beyond the periphery of the chip and a plurality of solder mounds having a lower melting point than said beam-leads extends from the surface of the chip to a point beyond the plane of the beam-leads.
This chip structure permits a method of automatic alignment of said plurality of beam-leads with a corresponding plurality of beam-leads on a dielectric substrate which involves placing the chip on the substrate so that said plurality of solder mounds are respectively in registration with a plurality of corresponding solder-wettable land pads on said non-wettable dielectric substrate. The structure is then heated to melt the solder mounds, wetting said land pads and thereby moving the chip so as to bring said beam-leads into registration with a plurality of corresponding land leads.
REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 3486223 (1969-12-01), Butera et al.
patent: 3791018 (1974-02-01), Johnston et al.
patent: 3869787 (1975-03-01), Umbaugh
IBM Corporation
Kraft J. B.
Ramsey K. J.
Smith Al Lawrence
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