4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Floyd K. Eide

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active

Chip stack and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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IC chip package having chip attached to and wire bonded within a

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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IC stack utilizing BGA contacts

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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IC stack utilizing secondary leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Stackable layers containing ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-752837

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