IC stack utilizing BGA contacts

Details IC stack utilizing BGA contacts IC stack utilizing BGA contacts

1998-06-10

2000-01-11

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257777, 257738, H05K 118, H05K 111, H01L 2350, H01L 23488

Patent

active

060143169

ABSTRACT:
A structure and process are disclosed in which IC chip-containing layers are stacked to create electronic density. Each layer is fabricated by forming one or more flexible circuit around a TSOP. Each flexible circuit contains conductors which are disposed to connect with TSOP leads, transpose signals to or from various locations on the top or bottom of the TSOP, and/or terminate in ball grid contacts for connection to other layers in the stack. The flexible circuit is bonded to the TSOP such that ball grid contacts are exposed on the top and bottom of the TSOP, and the ball grid array contacts on the bottom of the lowest layer are disposed to facilitate connection with a PCB or other circuitry.

REFERENCES:
patent: 4833568 (1989-05-01), Berhold
patent: 5166866 (1992-11-01), Kim et al.
patent: 5484959 (1996-01-01), Burns
patent: 5568363 (1996-10-01), Kitahara
patent: 5631193 (1997-05-01), Burns
patent: 5736780 (1998-04-01), Murayama
patent: 5767528 (1998-06-01), Sumi et al.
patent: 5790380 (1998-08-01), Frankeny

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