Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
Inventor
active
Chip-size package (CSP) using a multi-layer laminated lead frame
Lead frames including extended tie-bars, and semiconductor chip
Method for manufacturing a chip scale package having copper...
Multi-chip package
Semiconductor device package having twice-bent tie bar and...
No associations
LandOfFree
Do Soo Jeong does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Do Soo Jeong, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Do Soo Jeong will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-403370