David M. Ostrowski

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High power, pluggable tape automated bonding package

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Metal oxide semiconductor gated turn-off thyristor having an int

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Method of packaging and powering integrated circuit chips and th

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
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Power semiconductor component with switch-off facility

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Semiconductor cooling apparatus and cooling method thereof

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
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Profile ID: LFUS-PAI-P-477247

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