Semiconductor cooling apparatus and cooling method thereof

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section

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357 75, 357 81, 165 804, 16510433, 361385, H01L 2302, H01L 2504, H01L 2316

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active

049491644

ABSTRACT:
High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

REFERENCES:
patent: 3741292 (1973-06-01), Aakalu et al.
patent: 4050507 (1977-09-01), Chu et al.
patent: 4182412 (1980-01-01), Shum
patent: 4203129 (1980-05-01), Oktay et al.
patent: 4381818 (1983-05-01), Sachar et al.
patent: 4619316 (1986-10-01), Nakayama et al.
patent: 4694378 (1987-09-01), Nakayama et al.
Hwang et al., "Subcooled Flow Boiling with Flow Pattern Control", IBM Tech. Disclosure Bulletin, vol. 22, No. 5, Oct. '79 (pp. 1843-1844).
Chu & Simons, "Thermal Card and Coding", IBM Tech. Dis. Bull., vol. 10, No. 10, Mar. 1968 (pp. 1559-1560).

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