Method of packaging and powering integrated circuit chips and th

Details Method of packaging and powering integrated circuit chips and th Method of packaging and powering integrated circuit chips and th

1989-06-29

1990-09-04

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 70, 357 74, 357 79, 357 80, 361381, 361389, 361398, H01L 2302, H01L 2348, H01L 2342, H01L 3902

Patent

active

049548786

ABSTRACT:
An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

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