Patent
1988-07-25
1990-07-03
Hille, Rolf
357 69, 357 74, H01L 2302, H01L 2312, H01L 2348, H01L 2944
Patent
active
049395700
ABSTRACT:
A TAB package is described which includes a flexible dielectric film with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads, which leads extend into the aperture and connect to a semiconductor chip. Thermally conductive body means is provided which has a well formed therein, the well defined by a lip comprising the outer rim of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means and the flexible dielectric film is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.
REFERENCES:
patent: 3594619 (1971-07-01), Kamoshida et al.
patent: 4099200 (1978-07-01), Koutalides
patent: 4326238 (1982-04-01), Takeda et al.
patent: 4607276 (1986-08-01), Butt
patent: 4736236 (1988-04-01), Butt
patent: 4819041 (1989-04-01), Redmond
Bickford Harry R.
Mok Lawrence S.
Palmer Michael J.
Hille Rolf
International Business Machines Corp.
Ostrowski David M.
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