Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
Inventor
active
Chip packaging structure adapted to reduce electromagnetic...
Chip packaging structure without leadframe
Electrical-interference-isolated transistor structure
Integral heat spreader for semiconductor package
Reinforced die pad support structure
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Profile ID: LFUS-PAI-P-978512