4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with the removal of material by nonchemical means

Bih-Tiao Lin

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Apparatus for polishing and cleaning a wafer

Abrading – Machine – Combined
Patent

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Chemical mechanical polishing method for fabricating copper...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Chemical mechanical polishing pad with controlled polish rate

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Dynamically adjustable slurry feed arm for wafer edge...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Formation of finely controlled shallow trench isolation for...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-321556

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