Apparatus for polishing and cleaning a wafer

Details Apparatus for polishing and cleaning a wafer Apparatus for polishing and cleaning a wafer

1997-09-26

1999-03-30

Scherbel, David A.

Abrading

Machine

Combined

451288, 134184, B24B 704, B24B 722

Patent

active

058881247

ABSTRACT:
An apparatus for polishing and cleaning a semiconductor wafer (3028) is disclosed to substantially improve the efficiency of chemical-mechanical polishing. The apparatus reduces contamination to a clean room during fabrication of VLSI circuits. The apparatus includes a table (3026) supporting the wafer, and a polishing pad (3024) disposed on a surface of the wafer. The polishing pad performs chemical-mechanical polishing on the surface of the wafer. Further, at least one cleaning head (3042, 3044, 3046) is provided for cleaning the surface of the wafer. The wafer and the cleaning head are housed in a chamber (30). A guiding means (32) is used for guiding the cleaning head over the wafer to clean the surface of the wafer.

REFERENCES:
patent: 4854337 (1989-08-01), Bunkenburg et al.
patent: 5247954 (1993-09-01), Grant et al.
patent: 5618227 (1997-04-01), Tsutsumi et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5681396 (1997-10-01), Madanshetty

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