Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Examiner
active
No affiliations
Chip holder with wafer level redistribution layer
Heat spreader as mechanical reinforcement for ultra-thin die
Integrated circuit package system with insulator over circuitry
Microchip assembly including an inductor and fabrication method
Microelectromechanical system package
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Profile ID: LFUS-PAI-P-3306961