Integrated circuit package system with insulator over circuitry

Details Integrated circuit package system with insulator over circuitry Integrated circuit package system with insulator over circuitry

2008-05-23

2011-11-01

Williams, A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23036, C257SE21505, C257S686000, C257S685000, C257S777000, C257S723000, C257S684000, C257S796000, C257S666000, C257S738000, C257S737000, C257S778000, C257S784000, C257S786000

Reexamination Certificate

active

08049314

ABSTRACT:
An integrated circuit package system includes: providing a connection array; attaching a base integrated circuit adjacent the connection array; attaching a package integrated circuit over the base integrated circuit; attaching a package die connector to the package integrated circuit and the connection array; and applying a wire-in-film insulator over the package integrated circuit, the package die connector, the base integrated circuit, and the connection array, wherein the connection array is partially exposed.

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