Microchip assembly including an inductor and fabrication method

Details Microchip assembly including an inductor and fabrication method Microchip assembly including an inductor and fabrication method

2006-12-19

2011-11-08

Williams, A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S668000, C257S774000, C257S531000, C257S723000, C257S686000, C257S777000, C361S782000, C029S592100

Reexamination Certificate

active

08053890

ABSTRACT:
An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.

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