Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Patent
1995-03-13
1997-08-19
Dang, Trung
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
438480, H01L 21265
Patent
active
056588097
ABSTRACT:
A method of producing an SOI substrate having a single-crystal silicon layer on a buried oxide layer in an electrically insulating state from the substrate by implanting oxygen ions into a single crystal silicon substrate and practicing an anneal processing in an inert gas atmosphere at high temperatures to form the buried oxide layer. After the anneal processing in which the thickness of the buried oxide layer becomes a theoretical value in conformity with the thickness of the buried oxide layer formed by the implanted oxygen, the oxidation processing of the substrate is carried out in a high temperature oxygen atmosphere.
REFERENCES:
patent: 4749660 (1988-06-01), Short et al.
patent: 4824698 (1989-04-01), Jastrzebski et al.
patent: 4948742 (1990-08-01), Nishimura et al.
patent: 4975126 (1990-12-01), Margail et al.
patent: 5196355 (1993-03-01), Wittkower
patent: 5310689 (1994-05-01), Tomozane et al.
patent: 5429955 (1995-07-01), Joyner et al.
J. Stoemenos, et al., "New Conditions for Synthesizing SOI Structures by High Dose Oxygen Implantation", Journal of Crystal Growth, 73 (1985) 546-550.
C. Jaussaud, et al, "Defects in SIMOX Structures: Causes and Solutions", Vacuum, vol. 42, No. 5/6, pp. 341-347, 1991.
P.L.F. Hemment, et al, "Ion Beam Synthesis of Thin Buried Layers of SiO.sub.2 in Silicon", Vacuum, vol. 36, Nos. 11/12, pp. 877-881, 1986.
P.L.F. Hemment, et al, "Nucleation and Growth of SiO.sub.2 Precipitates in SOI/SIMOX Related Materials-Dependence Upon Damage and Atomic Oxygen Profiles", Nuclear Instruments and Methods in Physics Research, B39 (1989) 210-214.
J. Stoemenos, et al, "SiO.sub.2 Buried Layer Formation by Subcritical Dose Oxygen Ion Implantation", Appl. Phys. Lett. 48 (21), May 26, 1986, pp. 1470-1472.
J. Stoemenos, et al, "Nucleation and Growth of Oxide Precipitates in Silicon Implanted with Oxygen", Thin Solid Films, 135 (1986), 115-127.
Izumi Katsutoshi
Katayama Tatsuhiko
Nakashima Sadao
Ohwada Norihiko
Dang Trung
Komatsu Electronic Metals Co. Ltd.
Nippon Telegraph and Telephone Corporation
NTT Electronics Technology Corporation
LandOfFree
SOI substrate and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with SOI substrate and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and SOI substrate and method of producing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1104363