Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma
Reexamination Certificate
2007-05-15
2010-11-23
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Plasma
C257SE21328
Reexamination Certificate
active
07838399
ABSTRACT:
Methods for implanting ions into a substrate by a plasma immersion ion implanting process are provided. In one embodiment, a method for implanting ions into a substrate includes providing a substrate into a processing chamber, generating a plasma from a gas mixture including a reacting gas and a etching gas in the chamber, adjusting the ratio between the reacting gas and the etching gas in the supplied gas mixture and implanting ions from the plasma into the substrate. In another embodiment, the method includes providing a substrate into a processing chamber, supplying a gas mixture including reacting gas and a halogen containing reducing gas into the chamber, forming a plasma from the gas mixture, gradually increasing the ratio of the etching gas in the gas mixture, and implanting ions from the gas mixture into the substrate.
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Foad Majeed A.
Porshnev Peter
Applied Materials Inc.
Landau Matthew C
McCall-Shepard Sonya D
Patterson & Sheridan LLP
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