Method for building interconnect structures by injection molded

Details Method for building interconnect structures by injection molded Method for building interconnect structures by injection molded

1996-10-31

1998-07-07

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228 563, 438613, 438614, H05K 334

Patent

active

057755698

ABSTRACT:
A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

REFERENCES:
patent: 5193738 (1993-03-01), Hayes
patent: 5244143 (1993-09-01), Ference et al.
patent: 5346118 (1994-09-01), Degani et al.

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