4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Daniel George Berger

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Conductive adhesive composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Conductive adhesive composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Conductive adhesive rework method

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate

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Interconnect for low temperature chip attachment

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Method for building interconnect structures by injection molded

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Profile ID: LFUS-PAI-P-365553

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