Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Inventor
active
Apparatus and method for vacuum injection molding
Apparatus for transferring solder bumps and method of using
Etched glass solder bump transfer for flip chip integrated circu
Etched glass solder bump transfer for flip chip integrated...
Hybrid molds for molten solder screening process
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Profile ID: LFUS-PAI-P-365556