4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Rajesh Shankerlal Patel

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Method for building interconnect structures by injection molded

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Method for building interconnect structures by injection molded

Metal fusion bonding – Process – Preplacing solid filler
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Method for building interconnect structures by injection molded

Static molds – Container-type molding device – Plural article forming mold – or molds with community feature
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Profile ID: LFUS-PAI-P-701098

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