Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Inventor
active
Apparatus for transferring solder bumps and method of using
Direct chip attach for low alpha emission interconnect system
Interconnect for low temperature chip attachment
Method and apparatus for forming solder bumps
Method and apparatus for forming solder bumps
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Profile ID: LFUS-PAI-P-365554