Method and structure for determining thermal cycle reliability

Details Method and structure for determining thermal cycle reliability Method and structure for determining thermal cycle reliability

2006-08-29

2006-08-29

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S638000, C438S927000, C257S048000, C029S593000, C324S765010

Reexamination Certificate

active

07098054

ABSTRACT:
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

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