4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Vincent J. McGahay

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Building metal pillars in a chip for structure support

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Building metal pillars in a chip for structure support

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Carbon-free hydrogen silsesquioxane with dielectric constant les

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Control of liner thickness for improving thermal cycle...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Control of liner thickness for improving thermal cycle...

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1890275

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