Integration of ALD/CVD barriers with porous low k materials

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...

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C438S785000

Reexamination Certificate

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10741422

ABSTRACT:
A method for processing substrates is provided. The method includes depositing and etching a low k dielectric layer on a substrate, pre-cleaning the substrate with a plasma, and depositing a barrier layer on the substrate. Pre-cleaning the substrate minimizes the diffusion of the barrier layer into the low k dielectric layer and/or enhances the deposition of the barrier layer.

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