4. Semiconductor device manufacturing: process
  5. Forming schottky junction
  6. Using platinum group metal
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Fabrication of metal contacts for deep-submicron technologies

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate

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Fully nickel silicided metal gate with shallow junction formed

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
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Fully silicided gate electrodes and method of making the same

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
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FUSI integration method using SOG as a sacrificial...

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
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FUSI integration method using SOG as a sacrificial...

Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate

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