Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate
2006-01-24
2010-06-08
Lee, Hsien-ming (Department: 2823)
Semiconductor device manufacturing: process
Forming schottky junction
Using platinum group metal
C438S583000, C438S663000, C257SE29156
Reexamination Certificate
active
07732312
ABSTRACT:
A method for making a transistor20that includes using a transition metal nitride layer200and/or a SOG layer220to protect the source/drain regions60from silicidation during the silicidation of the gate electrode90. The SOG layer210is planarized to expose the transition metal nitride layer200or the gate electrode93before the gate silicidation process. If a transition metal nitride layer200is used, then it is removed from the top of the gate electrode93before the full silicidation of the gate electrode90.
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Jiang Ping
Lu Jiong-Ping
Obeng Yaw S.
Tran Joe G.
Brady W. James
Keagy Rose Alyssa
Lee Hsien-ming
Parendo Kevin
Telecky , Jr. Frederick J.
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