3 dimensional layered flex circuit electronic assembly...
3- and 4-terminal capacitors with "Faraday-shielded" connections
3-D communication and interconnect technique for increased numbe
3-D integrated circuit assembly employing discrete chips
3-terminal capacitor
3.5 inch hot-swappable docking module
3D interconnection process for electronic component packages and
3D multi-layer heat conduction diffusion plate
3U payload module configurations