3-D communication and interconnect technique for increased numbe

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361735, 361790, H05H 720

Patent

active

053294181

ABSTRACT:
A circuit board packaging structure includes an array of rectangular pipe-shaped circuit modules with rows and columns. Each of the circuit modules has two opposite openings, inner wall surfaces which permit electric circuit components to be mounted thereon and have wiring patterns for electrical interconnection among the circuit components, and outer wall surfaces. Intermodule connectors are provided on the outer wall surfaces of the pipe-shaped circuit modules to permit electrical interconnection between each of the circuit modules and its associated circuit module. A cooling medium is forced to flow through each of the circuit modules in one direction, thereby directly or indirectly cooling the electric circuit components such as semiconductor integrated circuit devices mounted on the inner wall surfaces of the circuit modules.

REFERENCES:
patent: 3467892 (1969-09-01), Sprude et al.
patent: 4401351 (1983-08-01), Record
The MIT Report, vol. XIX, No. 5, Ward, pp. 1, 5, Jun. 1991, "Numesh: Innovation in Computer Design."

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