Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-11-18
1994-07-12
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361735, 361790, H05H 720
Patent
active
053294181
ABSTRACT:
A circuit board packaging structure includes an array of rectangular pipe-shaped circuit modules with rows and columns. Each of the circuit modules has two opposite openings, inner wall surfaces which permit electric circuit components to be mounted thereon and have wiring patterns for electrical interconnection among the circuit components, and outer wall surfaces. Intermodule connectors are provided on the outer wall surfaces of the pipe-shaped circuit modules to permit electrical interconnection between each of the circuit modules and its associated circuit module. A cooling medium is forced to flow through each of the circuit modules in one direction, thereby directly or indirectly cooling the electric circuit components such as semiconductor integrated circuit devices mounted on the inner wall surfaces of the circuit modules.
REFERENCES:
patent: 3467892 (1969-09-01), Sprude et al.
patent: 4401351 (1983-08-01), Record
The MIT Report, vol. XIX, No. 5, Ward, pp. 1, 5, Jun. 1991, "Numesh: Innovation in Computer Design."
Kabushiki Kaisha Toshiba
Thompson Gregory D.
LandOfFree
3-D communication and interconnect technique for increased numbe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with 3-D communication and interconnect technique for increased numbe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and 3-D communication and interconnect technique for increased numbe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-401192